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DigiFabCon 2018 Scholarships Available

TIES has partnered with Chevron to offer a scholarship that covers conference registrations to the March 27-28, 2018 DigiFabCom. To be eligible, speakers in education, entrepreneurship and technology/manufacturing should submit an Ignite Talk about a project you’d like to present at the conference. All submissions will be entered to win prizes including a MakerBot Replicator, donated […]

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